Heat-resistant bonding sheet LIOELM TSU™ 0041SI Series
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LIOELM TSU™ 0041SI series is a thermosetting adhesive sheet for fixing reinforcement plates of FPCs.
It is a heat-resistant heat curable adhesive sheet designed to withstand the high temperature of lead-free solder reflow of 220~260°C, which can be cured for a short time at low temperatures.
It has excellent adhesion and heat resistance, and is ideal for applications such as bonding reinforcement plate to FPC, bonding sheet for multi-layer FPC, and bonding of TAB and stiffener in T-BGA. It is halogen-free, cadmium-free, and lead-free. It is suitable for stiffener bonding, heat spreader bonding, and various reinforcement plates for FPC (copper, SUS, polyimide, galaepo, Al, etc.).
It is a heat-resistant heat curable adhesive sheet designed to withstand the high temperature of lead-free solder reflow of 220~260°C, which can be cured for a short time at low temperatures.
It has excellent adhesion and heat resistance, and is ideal for applications such as bonding reinforcement plate to FPC, bonding sheet for multi-layer FPC, and bonding of TAB and stiffener in T-BGA. It is halogen-free, cadmium-free, and lead-free. It is suitable for stiffener bonding, heat spreader bonding, and various reinforcement plates for FPC (copper, SUS, polyimide, galaepo, Al, etc.).
Characteristics
- Has excellent conformability and solder reflow heat resistance.
- Demonstrates high adhesion to gold plating and various FPC components.
- Halogen-free environmentally friendly product UL registered product
Inquiries
TOYOCHEM CO., LTD. Information and Communication Materials Sales Division
TEL:03-3272-0905