Moldable conductive paste (development product)

Three-dimensional circuit components can be easily manufactured by combining printing and thermoforming.
It is possible to add circuit functions such as heaters and touch switches to the curved parts, and to save space and reduce the number of parts by wiring inside the device housing.

Functions

Moldability (vacuum molding, vacuum pressure molding, film insert molding, etc.)

Application example

3D touch panels, complex-shaped touch switches, 3D heaters, 3D antennas, wiring inside the device housing

Applicable base material

PC, PET

Representative characteristics

Characteristics table (reference value)
Product name	Silver coated copper type (development product)	Remarks
hardening type	heat curing	Recommended: 120℃30min.
Appearance	silver, pasty
Viscosity (Pa・s@25℃)	50	E-type viscometer/5rpm
Volume resistivity (Ω・cm)	1～^4x10-4	120℃30min.When drying
Printing method	flat screen

*The above values are representative values and are not guaranteed values.

Example of continuous thin line printing

How to use ink and precautions

Please stir this conductive paste thoroughly before use.
Please store refrigerated (below 0℃ to 10℃).
We recommend using a ketone solvent to clean the plate. Cleaned with our product "S705 Solvent 2KC (Cyclohexanone)" and wiped with "VC102 Solvent C (MEK)".

Requests for use

This material is an example of our experimental data and cannot be guaranteed as the properties obtained will vary depending on printing/processing conditions, base materials, etc. Before using the product, please carefully check its intended use.
Before handling this product, be sure to read the "Product Safety Data Sheet" and handle with care.
If you are exporting this product overseas, please be sure to check with us.

Inquiries

TOYO INK CO., LTD. Marketing Headquarters New Business Development Department