Conductive Paste REXALPHA™ Series

The REXALPHA ™ series is a conductive paste that combines resin technology, dispersion technology, and drying and curing technology to achieve low resistance in a thin film.
It enables high-quality wire printing to form fine patterns, such as touch panel electrodes and RFID antenna circuit formation, and proposes a shift from the etching process and photolithography process to the printing method. In addition, outstanding continuous printing performance makes it possible to improve total productivity.
Applications include RFID, touch panel circuits, heaters, electromagnetic shielding, and various electrodes. We also have a lineup of silver pastes that can withstand molding and carbon pastes with low resistance in the ^10-3 Ω-cm range.

Product/development product lineup and volume resistivity

Metal type

Low resistance conductive paste

• Fine wire type
• Silver-coated copper type

Carbon type

Low-resistance silver paste that does not use silver

• Carbon Type
• High conductivity carbon type (development product)

Special items

Next generation conductive paste

• Moldable type (under development)

Products/development product lineup

Fine wire type RA FS 120 S

Silver paste specialized for fine pattern printing such as dense wiring areas

・Volume resistivity 4×10^-5 Ω・cm
・Issues that can be solved
I want to print dense fine lines in a limited space (L/S=50μm/50μm printing is possible)

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Silver-coated copper type RA FS 121 S

Paste using special copper coated with silver

・Volume resistivity 8×10^-5 Ω・cm
・Issues that can be solved
I want to replace silver paste, which is expensive and has unstable prices.

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Carbon type RA FS 090 S

Highly conductive general-purpose carbon type

・Volume resistivity 5×10^-2 Ω・cm
・Issues that can be solved
I want to use it for disposable purposes.

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High conductivity carbon type (development product)

Conductivity exceeding the limits of conventional conductive carbon types

・Volume resistivity 8×10^-3 Ω・cm
・Issues that can be solved
I want to use it for disposable purposes.
I want to use it for applications that require lower resistance than conventional carbon-based materials.

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Moldable type (under development)

Molded silver paste that adds three-dimensional wiring functionality to decorative films

・Volume resistivity 1~4 x10^-4 Ω・cm
・Issues that can be solved
I want to add functionality to the curved surfaces of parts.
I want to save space inside the device housing.

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We select the most suitable conductive paste according to the application and required functions.
We will consult with you regarding considerations for commercialization, such as plate making, printing tests, and evaluation.

• The data on this page is an example of our experimental conditions, and we do not guarantee that the ink performance of this product will match this data. Performance may vary depending on printing conditions, processing conditions, base material, etc., so please check the actual configuration in advance.
• Please do not apply for industrial property rights based on this page.
• If you receive a sample, please do not analyze it.
• The images on this page are for illustrative purposes only.