Conductive Paste REXALPHA™ Series
The REXALPHA® ™ series is a conductive paste with a thin film that combines resin technology, dispersion technology, and drying and curing technology to achieve low resistance.
It enables high-quality wire printing to form fine patterns, such as touch panel electrodes and RFID antenna circuit formation, and proposes a shift from the etching process and photolithography process to the printing method. In addition, outstanding continuous printing performance makes it possible to improve total productivity.
Applications include RFID, touch panel circuits, heaters, electromagnetic shielding, and various electrodes. We also have a lineup of silver pastes that can withstand molding, carbon pastes with low resistance in the range of 10-3 Ω·cm, and UV-curable conductive silver pastes that can be applied to rotary screen printing.
It enables high-quality wire printing to form fine patterns, such as touch panel electrodes and RFID antenna circuit formation, and proposes a shift from the etching process and photolithography process to the printing method. In addition, outstanding continuous printing performance makes it possible to improve total productivity.
Applications include RFID, touch panel circuits, heaters, electromagnetic shielding, and various electrodes. We also have a lineup of silver pastes that can withstand molding, carbon pastes with low resistance in the range of 10-3 Ω·cm, and UV-curable conductive silver pastes that can be applied to rotary screen printing.
Product/development product lineup and volume resistivity
Metal type
Low resistance conductive paste
- 01 Thin line type
- 02 Low temperature curing type
- 03 UV curing type
- 04 Silver coated copper type (development product)
Carbon type
Low-resistance silver paste that does not use silver
Special items
Next generation conductive paste
Products/development product lineup
01 Thin wire type RA FS 059 S
Silver paste specialized for fine pattern printing such as dense wiring areas
・Volume resistivity 4×10-5 Ω・cm
・Issues that can be solved
I want to print dense fine lines in a limited space (L/S=50μm/50μm printing is possible)
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・Volume resistivity 4×10-5 Ω・cm
・Issues that can be solved
I want to print dense fine lines in a limited space (L/S=50μm/50μm printing is possible)
02 Low temperature curing type RA FS 110 TS
Silver paste with excellent low temperature drying properties
・Volume resistivity 2.3×10-5 Ω・cm
・Issues that can be solved
I want to print on heat-sensitive substrates (can be dried in 30 minutes at 80℃)
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・Volume resistivity 2.3×10-5 Ω・cm
・Issues that can be solved
I want to print on heat-sensitive substrates (can be dried in 30 minutes at 80℃)
03 UV curing type RA FS FD 076 S
UV-curable silver paste
・Volume resistivity 4×10-5 Ω・cm
・Issues that can be solved
Want to minimize heat damage to the base material
I want to form circuits with the high productivity of rotary screen printing.
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・Volume resistivity 4×10-5 Ω・cm
・Issues that can be solved
Want to minimize heat damage to the base material
I want to form circuits with the high productivity of rotary screen printing.
04 Silver coated copper type (development product)
Paste using special copper coated with silver
・Volume resistivity 8×10-5 Ω・cm
・Issues that can be solved
I want to replace silver paste, which is expensive and has unstable prices.
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・Volume resistivity 8×10-5 Ω・cm
・Issues that can be solved
I want to replace silver paste, which is expensive and has unstable prices.
05 Carbon type RA FS 090 S
Highly conductive general-purpose carbon type
・Volume resistivity 5×10-2 Ω・cm
・Issues that can be solved
I want to use it for disposable purposes.
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・Volume resistivity 5×10-2 Ω・cm
・Issues that can be solved
I want to use it for disposable purposes.
06 Highly conductive carbon type (development product)
Conductivity exceeding the limits of conventional conductive carbon types
・Volume resistivity 8×10-3 Ω・cm
・Issues that can be solved
I want to use it for disposable purposes.
I want to use it for applications that require lower resistance than conventional carbon-based materials.
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・Volume resistivity 8×10-3 Ω・cm
・Issues that can be solved
I want to use it for disposable purposes.
I want to use it for applications that require lower resistance than conventional carbon-based materials.
07 Moldable type (developed product)
Molded silver paste that adds three-dimensional wiring functionality to decorative films
・Volume resistivity 1~4 x10-4 Ω・cm
・Issues that can be solved
I want to add functionality to the curved surfaces of parts.
I want to save space inside the device housing.
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・Volume resistivity 1~4 x10-4 Ω・cm
・Issues that can be solved
I want to add functionality to the curved surfaces of parts.
I want to save space inside the device housing.
We select the most suitable conductive paste according to the application and required functions.
We will consult with you regarding considerations for commercialization, such as plate making, printing tests, and evaluation.
We will consult with you regarding considerations for commercialization, such as plate making, printing tests, and evaluation.
- The data on this page is an example of our experimental conditions, and we do not guarantee that the ink performance of this product will match this data. Performance may vary depending on printing conditions, processing conditions, base material, etc., so please check the actual configuration in advance.
- Please do not apply for industrial property rights based on this page.
- If you receive a sample, please do not analyze it.
- The images on this page are for illustrative purposes only.
Inquiries
TOYO INK CO., LTD. Marketing Headquarters New Business Development Department
TEL:+81-3-3272-0919